Google has introduced Ironwood, its seventh-generation Tensor Processing Unit (TPU) at Google Cloud Next 2025. The processor unit is specifically designed to support large-scale inference workloads.

The chip marks a shift in focus from training to inference, reflecting broader changes in how AI models are used in production environments. TPUs have been a core part of Google’s infrastructure for several years, powering internal services and customer applications. Ironwood continues with enhancements for the next wave of AI applications – including large language models (LLMs), Mixture of Experts (MoEs), and other compute-intensive tools that require real-time responsiveness and scalability.

Inference takes centre stage

Ironwood is designed to support what Google calls the “age of inference,” in which AI systems interpret and generate insights actively, rather than just responding to inputs. The shift is reshaping how AI models are deployed, particularly in business use, where continuous, low-latency performance is important.

Ironwood represents a number of architectural upgrades: Each chip provides 4,614 teraflops at peak performance, supported by 192GB of high bandwidth memory and up to 7.2 terabytes per second of memory bandwidth – significantly more than in previous TPUs.

The expanded memory and throughput are to support models requiring rapid access to large datasets, like those used in search, recommendation systems, and scientific computing.

Ironwood also features an improved version of SparseCore, a component aimed at accelerating ultra-large embedding models that are often used in ranking and personalisation tasks.

Scale and connectivity

Ironwood’s scalability means it can be deployed in configurations from 256 to 9,216 chips in a single pod. At full scale, a pod delivers 42.5 exaflops of compute, making it more than 24 times more powerful than the El Capitan supercomputer, which tops out at 1.7 exaflops.

To support this level of distributed computing, Ironwood includes a new version of Google’s Inter-Chip Interconnect, which can communicate bidirectionally at 1.2 terabits per second. This helps reduce bottlenecks so data can move more efficiently across thousands of chips during training or inference. Ironwood is integrated with Pathways, Google’s distributed machine learning runtime developed by DeepMind. Pathways allows workloads to run on multiple pods, letting developers orchestrate tens or hundreds of thousands of chips for a single model or application.

Efficiency and sustainability

Power efficiency metrics show that Ironwood has twice the performance per watt as its predecessor, Trillium, able to sustain high output under sustained workloads. The TPU has a liquid-based cooling system, and according to Google, is nearly 30 times more power-efficient than the first Cloud TPU introduced in 2018. The emphasis on energy efficiency reflects growing concerns about the environmental impact of large-scale AI infrastructure, particularly as demand continues to grow.

Supporting real-world applications

Ironwood’s architecture supports “thinking models,” which are used increasingly in real-time applications like chat interfaces and autonomous systems. The TPU’s capabilities also offer the potential for use in finance, logistics, and bio-informatics workloads, which require fast, large-scale computations. Google has integrated Ironwood into its Cloud AI Hypercomputer strategy, which combines custom hardware and tools like Vertex AI.

What comes next

Google plans to make Ironwood publicly-available later this year to support workloads like Gemini 2.5 and AlphaFold, and the unit is expected to be used in research and production environments that demand large-scale distributed inference.

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The Nvidia chip crackdown in Malaysia is intensifying. The country is apparently facing mounting pressure from the United States to prevent advanced semiconductors from being diverted to China.

Malaysia’s Trade Minister Zafrul Aziz has confirmed the Malaysian government plans to tighten regulations on semiconductor movements in response to specific US demands to monitor high-end Nvidia chips entering the country. “[The US is] asking us to make sure that we monitor every shipment that comes to Malaysia when it involves Nvidia chips,” Aziz told the Financial Times [paywall]. “They want us to ensure that servers end up in the data centres they’re supposed to and not suddenly move to another ship.”

The minister has formed a special task force with Digital Minister, Gobind Singh Deo, to strengthen regulations around Malaysia’s rapidly-growing data centre industry, which heavily relies on chips from industry leader Nvidia. The move comes amid heightened concerns in the US that Malaysia may be serving as a transit point for advanced AI chips ultimately destined for China, in violation of US export controls.

Singapore fraud case highlights regional concerns

The Malaysian moves follow closely on the heels of a major fraud investigation in neighbouring Singapore, where authorities have charged three individuals – two Singaporeans and one Chinese national – over trades in hardware servers allegedly worth approximately $390 million.

During a press briefing in early March, Singapore’s Home Affairs Minister K Shanmugam stated that the servers in question “may contain Nvidia chips.” The case involves Dell and Supermicro servers imported from the US and subsequently sold to a company in Malaysia. “The question is whether Malaysia was a final destination or from Malaysia it went somewhere else, which we do not know for certain at this point,” Shanmugam said, adding that the Singaporean government had requested assistance from both the US and Malaysian authorities in its investigation.

Two of the individuals charged – Alan Wei Zhaolun, 48, and Aaron Woon Guo Jie, 40 – hold senior positions at Aperia Cloud Services as CEO and COO respectively. According to its website, Aperia claims to be “Nvidia’s first qualified Nvidia Cloud Partner in Southeast Asia,” with “priority access to the highest-performing [graphics processing units] available in the market.” The third individual, a 51-year-old Chinese national named Li Miang, is accused of claiming fraudulently that the end user of items he purchased was a Singaporean computer equipment sales company, Luxuriate Your Life.

US export controls on Nvidia chip and regional impact

The increased scrutiny stems from broader US efforts to obstruct China’s development of advanced technologies, particularly AI with potential military applications. During the final days of the Biden administration in late 2024, the US introduced a three-tier licensing system for AI chips designed for use in data centres, explicitly targeting Nvidia’s powerful graphics processing units (GPUs). The measures were designed to prevent Chinese companies from circumventing US restrictions by accessing restricted chips through third countries. The US is also investigating if Chinese AI firm DeepSeek (which made headlines recently about its impressive AI model performance) has been using banned US chips.

Malaysia’s growing data centre industry

Malaysia has emerged as one of the fastest-growing global data centre development markets, with much of this growth concentrated in the southern state of Johor. According to Zafrul, the state has attracted over $25 billion in investment from major technology companies, including Nvidia, Microsoft, and ByteDance (TikTok’s parent company) in the past 18 months alone. The country recently agreed to form a special economic zone with Singapore, further embedding it as a key player in regional technology infrastructure. However, with the growth comes an increased responsibility to ensure compliance with international export controls.

Challenges in enforcement

Minister Zafrul has acknowledged the significant challenges in tracking semiconductors through complex global supply chains. “The US is also putting much pressure on their own companies to be responsible for ensuring [chips] arrive at their rightful destination,” he said. “Everybody’s been asked to play a role throughout the supply chain.” He emphasised the difficulty of enforcement, stating plainly, “Enforcement might sound easy, but it’s not.”

Nvidia’s global sales patterns underscore the challenge. It generates nearly a quarter of its global sales through its Singapore office, raising attention in the US around potential hardware movements to China. Nvidia has maintained that almost all of these sales constitute invoicing of international companies through Singapore, with very few chips passing through the city-state.

Regional context and industry impact

The focus on semiconductor flows in Southeast Asia represents one aspect of broader technology trade restrictions in place. In a parallel development, the European Union recently sanctioned Splendent Technologies, a Singaporean chip distributor, as part of measures targeting companies allegedly helping Russia’s defence sector.

Balancing economic development with regulatory compliance presents a practical challenge for Malaysia. The country’s efforts to strengthen monitoring systems must address complex supply chains while be supportive of its growing position in the regional technology ecosystem. As Malaysia implements new oversight measures, technology companies operating in the region may face additional compliance requirements stemming from Kuala Lumpur. However, the precise impact on the broader semiconductor industry will depend on the specific implementation approach and enforcement capacity.

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Nvidia revealed new AI chips at its annual GTC conference on Tuesday. CEO Jensen Huang introduced two key products: the Blackwell Ultra chip family, which is expected to ship in the second half of this year, and Vera Rubin, a next-generation GPU set to launch in 2026.

The release of OpenAI’s ChatGPT in late 2022 has significantly boosted Nvidia’s business, with sales increasing more than sixfold. Nvidia’s GPUs play an important role in the training of advanced AI models, giving the company a market advantage. Cloud providers like Microsoft, Google, and Amazon will be evaluating the new chips to see if they provide enough performance and efficiency gains to justify further investment in Nvidia technology. “The computational requirement, the scaling law of AI, is more resilient, and in fact, is hyper-accelerated,” Huang said.

The new releases reflect Nvidia’s shift to an annual release cycle for chip families, moving away from its previous two-year pattern.

Nvidia expands role in AI infrastructure partnership

Nvidia’s announcements come as the company deepens its involvement in the AI Infrastructure Partnership (AIP), a collaborative effort to build next-generation AI data centres and energy solutions. On Wednesday, BlackRock and its subsidiary Global Infrastructure Partners (GIP), along with Microsoft and MGX, announced updates to the partnership. Nvidia and Elon Musk’s AI company, xAI, have joined the initiative, strengthening its position in AI infrastructure development.

Nvidia will serve as a technical advisor to the AIP, contributing its expertise in AI computing and hardware. The partnership aims to improve AI capabilities and focus on energy-efficient data centre solutions.

Since its launch in September 2024, AIP has attracted strong interest from investors and corporations. The initiative’s initial goal is to unlock $30 billion in capital, with a target to generate up to $100 billion in total investment potential through a mix of direct investment and debt financing.

Early projects will focus on AI data centres in the United States and other OECD countries. GE Vernova and NextEra Energy are recent members of the partnership, bringing experience in energy infrastructure. GE Vernova will assist with supply chain planning and energy solutions to support AI data centre growth.

Vera Rubin chip family

Nvidia’s next-generation GPU system, Vera Rubin, is scheduled to ship in the second half of 2026, consisting of two main components: a custom CPU, Vera, and a new GPU called Rubin, named after astronomer Vera Rubin. Vera marks Nvidia’s first custom CPU design, built on an in-house core named Olympus. Previously, Nvidia used off-the-shelf Arm-based designs. The company claims Vera will deliver twice the performance of the Grace Blackwell CPU introduced last year.

Rubin will support up to 288 GB of high-speed memory and deliver 50 petaflops of performance for AI inference – more than double the 20 petaflops handled by Blackwell chips. It will feature two GPUs working together as a single unit. Nvidia plans to follow up with a “Rubin Next” chip in 2027, combining four dies into a single chip to double Rubin’s processing speed.

Blackwell Ultra chips

Nvidia also introduced new versions of its Blackwell chips under the name Blackwell Ultra, created to increase token processing, allowing AI models to process data faster. Nvidia expects cloud providers to benefit from Blackwell Ultra’s improved performance, claiming that the chips could generate up to 50 times more revenue than the Hopper generation, which was introduced in 2023.

Blackwell Ultra will be available in multiple configurations, including a version paired with an Nvidia Arm CPU (GB300), a standalone GPU version (B300), and a rack-based version with 72 Blackwell chips. Nvidia said the top four cloud companies have already deployed three times as many Blackwell chips as Hopper chips. Nvidia also referred to its history of increasing AI computing power with each generation, from Hopper in 2022 to Blackwell in 2024 and the anticipated Rubin in 2026.

DeepSeek and AI reasoning

Nvidia addressed investor concerns about China’s DeepSeek R1 model, which launched in January and reportedly required less processing power than comparable US-based models. Huang framed DeepSeek’s model as a positive development, noting that its ability to perform “reasoning” requires more computational power. Nvidia said its Blackwell Ultra chips are designed to handle reasoning models more effectively, improving inference performance and responsiveness.

Broader AI strategy

The GTC conference in San Jose, California, drew about 25,000 attendees and featured presentations from hundreds of companies that use Nvidia hardware for AI development. General Motors, for example, announced plans to use Nvidia’s platform for its next-generation vehicles.

Nvidia also introduced new AI-focused laptops and desktops, including the DGX Spark and DGX Station, designed to run large models like Llama and DeepSeek. The company also announced updates to its networking hardware, which ties GPUs together to function as a unified system, and introduced a software package called Dynamo to optimise chip performance.

Nvidia plans to continue naming its chip families after scientists. The architecture following Rubin will be named after physicist Richard Feynman and is scheduled for release in 2028.

Want to learn more about AI and big data from industry leaders? Check out AI & Big Data Expo taking place in Amsterdam, California, and London. The comprehensive event is co-located with other leading events including Intelligent Automation Conference, BlockX, Digital Transformation Week, and Cyber Security & Cloud Expo.

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Apple has refreshed its MacBook Air lineup for 2025, equipping the 13-inch and 15-inch models with the M4 processor.

The new laptops retain their fanless cooling design, despite the increase in processing power. In a notable change, Apple has reduced the starting prices for both models. The 13-inch MacBook Air with M4 starts at $999, the same price as the previous M2 model. The 15-inch version is priced at $1,199, down from $1,299 for last year’s release.

Alongside the MacBook Air updates, Apple has introduced a new Mac Studio, offering configurations with either an M4 Max processor or a new M3 Ultra chip. Pricing for these desktops remains unchanged, with starting costs of $1,999 and $3,999, respectively.

MacBook Air upgrades: What’s new?

Apple has kept the overall design of the MacBook Air unchanged but introduced a new colour option, Sky Blue. The Midnight (black) model now includes fingerprint-resistant anodisation, similar to the MacBook Pro. The M4 chip’s improved performance and efficiency mean the M4 MacBook Air is twice as fast as the original M1 version. However, the performance increase over the M3 models looks to be more incremental.

The M4 processor enables several capabilities, including:

• Support for two external displays while the laptop is open, compared to just one on M3 models.
• A 12-megapixel Centre Stage camera with Desk View, featuring subject tracking.
• Up to 18 hours of battery life, consistent with the M3 MacBook Air.

Base configurations now come with 16GB of unified memory, an increase from 8GB, to support Apple Intelligence features. The 13-inch model starts with a 10-core CPU and an 8-core GPU, with the option of upgrading at the time of purchase to a 10-core GPU. The 15-inch model starts with the more powerful 10-core CPU and GPU combination. Apple continues to pitch the MacBook Air as an ultraportable everyday device, while the MacBook Pro lineup remains focused on users needing higher performance and active cooling.

Mac Studio returns with M3 Ultra and M4 Max

Apple has upgraded its Mac Studio desktop to include the M4 Max processor and the new M3 Ultra chip. Both versions now support Thunderbolt 5 connectivity, which allows for data transfers of up to 120 Gbps. This enables connection to high-speed accessories, including PCIe expansion hubs and external storage solutions.

The M4 Max model keeps its 16-core CPU and 40-core GPU, with memory configurations ranging from 36GB to 128GB. According to Apple, the M4 Max has 3.5 times the performance of the M1 Max. The M3 Ultra model uses Apple’s UltraFusion interconnect to combine two M3 Max processors into a single system-on-chip (SoC), resulting in:

• A 32-core CPU (two 16-core M3 Max chips).
• An 80-core GPU, designed for intensive computing and AI applications.
• Up to 512GB of unified memory, the highest capacity available in a compact desktop workstation.
• 800GBps memory bandwidth, doubling that of the M4 Max model.

The M3 Ultra model is being positioned for AI development, machine learning, and high-performance computing, while the M4 Max configuration is aimed at content creators and professionals who require powerful GPU acceleration.

MacBook Air pricing adjustments and market positioning

The MacBook Air lineup’s price cut comes as Apple faces more competition from Windows-based ultraportables. While Apple has not revealed the actual reason for the price drop, enhancements in chip manufacturing efficiency at TSMC may have contributed to cost savings. Apple is also discontinuing the M3 MacBook Air models, leaving the M1 MacBook Air, still sold at Walmart, as the only lower-cost alternative. By offering the MacBook Air with M4 at a lower price, Apple is positioning itself more aggressively in the ultraportable laptop segment, where Windows manufacturers like Asus, HP, and Dell have introduced compelling alternatives in the sub-$1,000 range.

Apple’s strategy for AI and performance gains

Apple’s latest Mac lineup continues its push toward AI-focused computing, with the M4 MacBook Air supporting Apple Intelligence features and the M3 Ultra Mac Studio catering to developers working on AI models.

While the M4 processor offers improved graphics processing, some of its ray-tracing enhancements are absent from the M3 Ultra, which prioritises high memory capacity and parallel processing. Apple’s approach suggests that its Ultra-series chips will continue to lag one generation behind in graphics advancements due to the dual-chip architecture.

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The hardware comprises Lenovo’s ThinkSystem V4 servers, which the company says offer better performance.

Lenovo says the ThinkSystem servers can manage tasks from astrophysics to static site web serving. The servers can reportedly achieve up to 6.1 times more than those with the previous generation of processors. Onboard MRDIMM technology doubles memory bandwidth for accelerated data processing in AI applications.

Scott Tease, Vice President of Lenovo Infrastructure Solutions Group and General Manager of the Product Line, said, “The new Lenovo ThinkSystem V4 servers represent the next generation of performance and innovation, achieving higher compute with less energy consumption and delivering AI-powered management that empowers businesses with fast and protected AI deployment across any environment.”

Tease said that the new systems were designed to address challenges related to limited power availability and provide higher performance when handling compute-intensive AI tasks.

The three servers, SR630 V4, SR650 V4, and SR650a V4, are designed for different uses, from generic cloud services, AI workloads, and GPU-intensive tasks.

The SR630 V4 is space-efficient at only 1U high, so can provide high-density computing for the cloud and fintech. The SR650 V4 server offers up to a quarter more software GPU capacity and doubles computation performance compared to previous models at this price point. Lenovo states that it’s suitable for simulation, modelling, engineering, and AI workloads.

The SR650a V4 is designed to deliver maximum AI power, capable of handling GPU-intensive workloads like machine learning and media analytics. The 2U2s platform can support up to four double-width GPUs, and front panel GPU access makes it easy to upgrade cards.

Lenovo’s Neptune liquid-cooling is also capable of freeing up internal space and reduce power use by improving overall thermal efficiency. In turn, this creates room for more resources in existing racks.

Lenovo’s ThinkSystem servers include an optional locking bezel to secure servers and their internal hardware, a bonus in remote settings where physical access may be more vulnerable.

XClarity One, Lenovo’s centralised systems management platform helps deploy, monitor and manage IT infrastructures. It simplifies Lenovo ThinkSystem V4 servers’ operations, and uses AI analytics to monitor the server components’ health.

XClarity One now includes a ‘Federated Directory’ which allows the management of complete systems from a centralised point, rather than separate access controls for each application. The directory uses a unified registry and a single account.

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Apple is gearing up to give its Vision Pro headset a much-needed shot in the arm, hoping to spark fresh interest in the $3,500 device that, let’s be honest, hasn’t exactly flown off the shelves. The company is planning a visionOS 2.4 update that could arrive as soon as April, according to people familiar with the plans. Developers might even get their hands on a beta version this week.

Leading the charge is the arrival of Apple Intelligence – Apple’s in-house AI system – on the Vision Pro. It’s the first time these features are extending beyond iPhones, iPads, and Macs. Vision Pro owners can expect tools like Writing Tools, Genmojis, and the Image Playground app, all powered by the headset’s M2 chip and 16GB of memory, enabling smooth on-device AI processing.

The timing isn’t random. Apple is facing stiff competition: Google recently unveiled Android XR, a mixed-reality operating system built around its Gemini AI, with Samsung gearing up to launch a headset running the platform later this year – a device that, going from leaked images, looks suspiciously like Apple’s Vision Pro.

But for all the AI upgrades, the bigger story may be Apple’s struggle to figure out where the Vision Pro fits. Over the past year, sales have been slower than hoped – hardly a shock given the steep price. Even Apple CEO Tim Cook described the headset as an “early-adopter product,” aimed at people who want “tomorrow’s technology today.”

There’s even talk that production is winding down. A report from The Information suggested that Apple might stop making the current Vision Pro soon, although it has enough supply to meet demand for now. Apple’s attention, it seems, is shifting toward what comes next – though exactly what that is remains hazy.

What’s next for Vision Pro?

Apple’s roadmap for its mixed-reality lineup appears to be in flux. Early rumours hinted at a second-generation Vision Pro packed with advanced features, but that project seems to have been put on pause. Instead, Apple’s priority is now believed to be a more affordable version – something closer in price to a high-end iPhone. That model, however, isn’t expected until at least 2027, according to analyst Ming-Chi Kuo.

More immediately, a smaller update to the current Vision Pro is being rumoured. Apple could swap in its upcoming M5 chip, providing a performance boost and possibly unlocking more advanced Apple Intelligence features, including an improved version of Siri. However, don’t expect big design changes. The refresh would likely reuse parts from the first-generation model to clear out leftover inventory.

There’s also been talk of 5G connectivity, although that might be reserved for a proper Vision Pro 2 further down the road.

Beyond AI: A content push and a smarter guest mode

Alongside the AI upgrades, Apple is trying to tackle another criticism – the lack of content tailored to the Vision Pro. The upcoming update will introduce a spatial content app designed to showcase 3D images and panoramic photos sourced from external providers. Apple hopes this will give users more to explore and drive interest in spatial media, which has so far been slow to take off. Adding to the content push, an immersive arctic surfing video will drop on February 21 via the Vision Pro’s TV app – a small but notable effort to flesh out the media experience.

On the usability front, guest mode is getting an upgrade. Apple is making it easier for Vision Pro owners to let friends and family try out the headset. For the first time, users will be able to set up guest access from their iPhone, selecting which apps are available. Previously, this all had to be done on the headset itself, which made lending it out a bit of a hassle.

Siri and Apple’s AI growing pains

While the update is bringing ChatGPT integration into Writing Tools, fans hoping for a smarter Siri on Vision Pro might be disappointed for now. Apple had planned a major Siri overhaul alongside this update, but engineering setbacks have reportedly pushed the release to May.

That delay is part of a broader struggle for Apple Intelligence. Critics have noted that Apple’s AI rollout has felt rushed, with Writing Tools, for instance, described as clunky and poorly integrated into Apple’s usual text tools. By contrast, the Image Playground app has been praised for offering a more user-friendly approach to AI-generated content – the kind of experience people expect from Apple.

Apple’s AI ambitions are still a work in progress. The company is seen as playing catch-up to rivals like OpenAI, Google, and Meta. While Apple Intelligence has started rolling out, key regions like continental Europe and China are still waiting, raising concerns about the company’s ability to keep pace in the fast-moving AI race.

The long view is that despite the growing pains, Apple isn’t giving up on mixed reality or AI. The visionOS 2.4 update is a step toward keeping the Vision Pro relevant, even as the company works out the future of the product line. Whether it’s the rumoured M5 refresh, the eventual low-cost model, or something else entirely, Apple is clearly playing the long game. For now, though, Vision Pro remains a product for the few – those willing to pay top dollar for a glimpse into Apple’s vision of the future.

Want to learn more about AI and big data from industry leaders? Check out AI & Big Data Expo taking place in Amsterdam, California, and London. This comprehensive event is co-located with other leading events including Intelligent Automation Conference, BlockX, Digital Transformation Week, and Cyber Security & Cloud Expo.

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For the second time in two years, YMTC, China’s leading memory chip maker, has proven that US trade restrictions have done little to slow its technological advancement. Fresh on the heels of its 2022 breakthrough with 232-layer NAND technology, the company has pushed boundaries again in memory chip innovation. The breakthrough came to light through research firm TechInsights’ analysis. It demonstrates YMTC’s mastery of the Xtacking4.0 design in high-density 3D NAND chips, and marks another instance of Chinese semiconductor technology advancing despite Washington’s attempts to contain it.

According to TechInsights’ recent report, quoted by the South China Morning Post, YMTC’s achievement was discovered in the commercial ZhiTai TiPro9000 solid-state storage device. The device features an advanced dual-deck structure with 150 gates on the lower deck and 144 gates on the upper deck, totalling an impressive 294 gates.

The design employs sophisticated hybrid-bonding techniques to join two wafers, achieving an unprecedented storage density exceeding 20 gigabits per square millimetre.

YMTC’s journey from latecomer to industry pioneer

Since its inception in 2016, YMTC has transformed from newcomer to formidable competitor in the global flash memory industry. The company’s rapid technological advancement was first highlighted in 2022 when it produced a groundbreaking 232-layer NAND flash, surpassing the abilities of industry giants like Micron Technology, Samsung Electronics, and SK Hynix.

The achievement was particularly notable as it came just before the company was added to Washington’s export blacklist that was assembled over national security concerns. TechInsights senior analyst Jeongdong Choe emphasises the significance of this latest development, stating, “The important takeaway is that China’s YMTC has beaten the competition in the market. With the new Xtacking4.0 technology, YMTC appears to have found a way to overcome the current ban with this new chip.”

Challenging global leaders despite trade restrictions

After being blacklisted two years ago, YMTC lost access to important semiconductor equipment makers like Lam Research. However, the company adapted, strengthening its partnerships with domestic chip tool manufacturers like Naura Technology Group. YMTC’s achievements have caught the attention of global competitors, particularly in hybrid bonding technology. “YMTC is the leader in hybrid bonding technology, which is essential for higher-layered 3D NAND,” Choe explains. “That’s why Samsung and other NAND companies follow and prepare the hybrid bonding structure for the next generations.”

While YMTC maintains a modest public stance about its breakthrough, simply stating it is “committed to driving global innovation to propel the industry further forward and meet the evolving needs of our customers and partners,” the implications of its achievement are far-reaching. The company’s success demonstrates China’s growing capability to develop advanced semiconductor technology independently despite international trade restrictions.

The global memory chip landscape is competitive, with SK Hynix announcing plans to mass-produce 321-layer 4D NAND chips in the first half of this year. However, according to TrendForce, the market faces challenges from weak demand and oversupply, exacerbated by aggressive production expansion from Chinese suppliers driven by domestic substitution policies. The latest memory chip breakthrough by YMTC showcases China’s technological resilience and signals a shifting dynamic in the global semiconductor industry. As the company continues to push boundaries in memory chip innovation, it demonstrates how trade restrictions may be driving rather than hampering Chinese technological self-sufficiency.

The achievement also validates YMTC’s potential as a serious contender in the global market, supporting earlier speculation that the company was considered a potential supplier for major international technology companies, including Apple, before US trade restrictions were imposed. As global competition in NAND flash memory intensifies, YMTC’s success suggests that the landscape of semiconductor manufacturing may be evolving more rapidly than anticipated, with implications for both market dynamics and international trade policies.

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Users of smartphones in areas where there is no network access may have cause for optimism, after the news that Vodafone claims to have made the world’s first video call via the satellite network.

The call was made from an area in the UK with no network coverage to the company’s CEO, Margherita Della Valie.

According to a report from Reuters, Vodafone used AST SpaceMobile’s BlueBird satellites positioned in low Earth orbits to allow the transfer of up to 120 megabits of data per second; enough, in the test, to carry a videophone conversation, like that in common apps like Apple’s FaceTime, Google Meet or Microsoft Teams. In an interview with the news agency, Della Vaile said, “You get everything form voice to text to video data transmission […]. Our objective is to bring the service to our customers as soon as possible.”

The UK-based telco giant aims to launch the technology to its European customers late 2025 through into 2026, connecting rural, mountainous, and less populous areas in the UK and on the mainland continent to the mobile network.

The technology relies on the carrier having a gateway on the ground that receives signals from the satellite network. Message packets are then transferred to the traditional cellular network. Vodafone’s success was notable due to the high volume of data that was transmitted and received concurrently.

Smartphone to satellite for all?

Unlike instances of similar technology such as that found in some Apple handsets, Vodafone claims that the communications capability will work from a standard smartphone, and requires no specialist hardware in the remote area.

There is fierce competition between mobile operators to be first to market with satellite services, each keen to fill the gap in conventional, land-based mobile coverage. At present, smartphone to satellite communication is possible, but traffic bandwidth is highly limited and only handsets with specific, satellite-capable modems can use the facility.

Apple’s iPhone models 14 and later, for instance, offer the ability to send texts in emergencies, provide geolocation data, and send limited data to selected numbers. Later models of phones by Google and Samsung offer similar features.

In the US, T-Mobile and SpaceX are racing to develop technologies similar to that showcased by Vodafone in the UK.

However, Chinese scientists announced the Tiantong project in 2024, which uses the three Tiantong-1 satellites in geosynchronous orbits over Asia. Technology on these satellites combats signal degradation to the extent that they can send and receive signals from smartphones on the ground.

The simpler smartphone future

It is worth noting that the bandwidth available to end-users of any future implementation will almost definitely not be the 120 megabits per second achieved by Vodafone. With stringent contention ratios, it seems unlikely that consumers will be making video calls from the middle of nowhere to loved ones, or watching streamed sports events on their smartphones while in remote areas. But the basics of communications like low-quality voice calls and SMS texts should be more widely available in the next few years.

A time when geographic isolation no longer means lack of communication is drawing closer, giving hope to communities not well-served by current mobile network infrastructure.

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Since its inception in 1994, Bluetooth has dominated short-range wireless connectivity, but its limitations have become increasingly apparent after three decades. With growing demands for faster data transfer, multiple device connections, and enhanced security, the ageing protocol struggles to keep pace with modern requirements. 

As IoT devices proliferate and wireless audio streaming becomes ubiquitous, China sees an opportunity to develop Bluetooth alternative technologies, citing concerns over Bluetooth protocols’ limitations. China’s Bluetooth alternative, Star Flash, is emerging as a potential game-changer in wireless communication technology, marking a significant global technological shift. The initiative, backed by Beijing’s Electronics Video Industry Association, represents more than just a technical upgrade – it’s a strategic move toward technological self-reliance.

The alternative to Bluetooth in China: the technical promise of Star Flash

The SparkLink Alliance, a consortium of hundreds of Chinese developers and manufacturers, including tech giant Huawei, is spearheading the development of Star Flash. According to Chinese IoT hardware vendor Qogrisys, the technology incorporates 5G network principles and offers several advantages over existing protocols. 

It promises enhanced multiple-device connectivity, improved power efficiency, longer battery life, and high-quality lossless stereo audio streaming capabilities. Its integration into China’s newly mandated ‘universal remote control standard’ sets Star Flash apart. It standard requires manufacturers to implement one of three communication methods: traditional infrared, conventional Bluetooth, or Star Flash. 

The strategic inclusion of Star Flash alongside established technologies provides a foundation for widespread adoption, starting with consumer electronics. 

Strategic implementation and global implications

The rollout strategy for Star Flash appears carefully orchestrated. Beginning with universal remote controls in 2025, the technology is positioned to rapidly penetrate the domestic market through mandatory implementation in televisions and set-top boxes. An article by The Register suggests that Chinese manufacturer Konka has already launched the first Smart TV compatible with the new standard, demonstrating the industry’s readiness to embrace the technology.

However, China’s ambitions for Star Flash extend beyond its borders. The SparkLink Alliance has actively promoted the technology to Japanese companies and the expanding BRICS bloc, suggesting a broader international strategy. The expansion could challenge the dominance of existing wireless protocols in emerging markets.

While developing alternative wireless technologies contributes to technological diversity and innovation, it raises questions about global tech standards and interoperability. A Star Flash success could influence how future wireless technologies are developed and adopted, potentially leading to a more fragmented wireless technology landscape, or one where the vaguaries of Bluetooth are consigned to history.

Critics raise concerns about potential surveillance capabilities (this being China), while supporters emphasise the technical advantages and the importance of diverse technological ecosystems. The reality likely lies somewhere in between—Star Flash represents both technological advancement and strategic positioning in the global tech arena.

As the wireless communication landscape evolves, the emergence of Star Flash invites us to look beyond traditional narratives of technological competition and consider how diverse or improved approaches to wireless communication might benefit global innovation. 

Whether this leads to healthy competition and innovation or further technological fragmentation remains to be seen. 

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As a result of this convenience, coupled with the sophistication of today’s smartphones and the transition to home-working, many workers now opt to use their personal devices for work. Indeed, a Gartner survey^* taken during the pandemic found that 55 per cent of employees used a personally owned smartphone or laptop to perform their duties.

However, employees will use their consumer-grade products for both work and personal use, making them more vulnerable to cybersecurity threats. They also rarely meet the same security standards as bespoke workplace devices, creating a risk of non-compliance with cybersecurity policy. Furthermore, consumer mobiles tend to fall short of the requirements necessary for intensive use in a professional setting, and do not come with enterprise-level support when technical problems arise.

Zebra Technologies now offers a solution with its TC22 and TC27 mobile computers, which combine affordability with top-tier features that enhance productivity and workflow efficiency. Unlike typical consumer-grade smartphones, the TC22 and TC27 are purpose-built and drop tested, ensuring durability that lasts for years whether used inside the warehouse or at the mercy of the harshest outdoor elements. They come with liquid and dust resistance to IP68 and IP65 standards, and the display screen and scanner exit window are made from Corning Gorilla Glass for high durability.

Both the TC22 and TC27 are equipped with Wi-Fi 6/6E^** connectivity, with the latter boasting 5G, ensuring constant, lightning-fast data transfer and superior voice quality in different working environments. The devices run on a Qualcomm 5430 2.1GHz processor that delivers twice the performance of its predecessors, meaning seamless multitasking across applications and fast response times.

Designed for usability, the TC22 and TC27 have advanced six-inch FHD+ displays that reduce the need for constant scrolling and can be used in bright sunlight. The ergonomic design, nearly 10 per cent thinner than previous models, runs on Android, guaranteeing access to the latest features and updates as well as a familiar interface, with future upgrades to Android 16 supported.

The devices also integrate enterprise-class scanning options that can read high rise shelfing in the warehouse, first-time-every-time barcode capture and support for contactless transactions and cards stored in Apple or Google wallets; features that are quickly becoming essential for merchants. Moreover, users get a built-in advantage at no-cost with Zebra’s Mobility DNA Professional suite, that provides security updates, lifecycle management and analytics that maximise user productivity and protection from cyber threats.

Both devices offer flexible battery choices to match various work patterns. The standard 3800 mAh battery suits full-shift power needs, while the optional extended 5200 mAh battery caters to multi-shift demands. The removable batteries ensures uninterrupted operations without downtime for charging.

Beyond their core features, the TC22 and TC27 offer purpose-built accessories such as single and multi-slot cradles for various charging options, snap-on trigger handles for quicker scanning and wearable arm mounts for hands-free operation. These accessories are tailored to different work environments, from retail to field service.

Zebra has provided mobile computing solutions for all businesses and budgets for the last 50 years. Unlike consumer smartphones, the TC22 and TC27 are designed specifically for workplace use with powerful business features at an affordable price. They are rugged and durable, working to boost worker productivity. To learn more about what the TC22 and TC27 can do for your business, visit the Zebra product site or contact one of the expert team today.

^*Source: https://www.gartner.com/en/newsroom/press-releases/2021-04-26-gartner-survey-finds-1-in-5-workers-consider-themselves-digital-technology-experts-since-covid-19

^**Mobility DNA Enterprise License is required for Wi-Fi 6E

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